Global Temporary Wafer Bonding and Debonding System Market Set for Dynamic Growth Amid Semiconductor Innovation https://dataintelo.com/report/global-temporary-wafer-bonding-and-debonding-system-market The Temporary Wafer Bonding and Debonding System Market is gaining significant momentum due to the rapid advancements in semiconductor manufacturing and miniaturization technologies. These systems play a critical role in enabling 3D integration and wafer-level packaging—key processes that support high-performance computing, memory devices, and next-generation sensors. According to recent market intelligence, the global temporary wafer bonding and debonding system market was valued at USD 465 million in 2023 and is projected to reach USD 896 million by 2031, expanding at a robust CAGR of 8.5% during the forecast period. This growth is fueled by rising demand for high-density IC packaging and increased adoption of MEMS and CMOS image sensors in various sectors.